Kushanduka-shanduka uye kufambira mberi kweCPOoptoelectronictekinoroji yekubatanidza zvinhu
Kurongedza pamwe chete kweOptoelectronic hakusi tekinoroji itsva, kuvandudzwa kwayo kunogona kuteverwa kumashure kusvika kuma1960, asi panguva ino, kurongedza pamwe chete kwephotoelectric ingori pasuru iri nyore yezvishandiso zvemagetsi zve optoelectronicpamwe chete. Pakazosvika makore ekuma1990, nekumuka kwemodule yekutaurirana yemazisoMuindasitiri, photoelectric copackaging yakatanga kubuda. Nekuwedzera kwesimba remakomputa akawanda uye kudiwa kwakanyanya kwebandwidth gore rino, photoelectric co-packaging, pamwe nehunyanzvi hwayo hwebazi, zvave kutariswa zvakare.
Mukuvandudza tekinoroji, danho rega rega rinewo mafomu akasiyana, kubva pa2.5D CPO inoenderana nekudiwa kwe20/50Tb/s, kusvika ku2.5D Chiplet CPO inoenderana nekudiwa kwe50/100Tb/s, uye pakupedzisira inoita 3D CPO inoenderana nekudiwa kwe100Tb/s.
Iyo 2.5D CPO inorongedza zvinhumodule yemazisouye chip ye network switch iri pa substrate imwe chete kupfupisa daro remutsetse uye kuwedzera huwandu hweI/O, uye 3D CPO inobatanidza zvakananga optical IC kune intermediary layer kuti iwane kubatana kweI/O pitch iri pasi pe50um. Chinangwa chekushanduka kwayo chakajeka kwazvo, chinova kuderedza daro riri pakati pe photoelectric conversion module ne network switching chip zvakanyanya sezvinobvira.
Parizvino, CPO ichiri kutanga, uye kuchine matambudziko akadai sekuwana goho shoma uye mari yakawanda yekugadzirisa, uye vagadziri vashoma vari pamusika vanogona kupa zvigadzirwa zvine chekuita neCPO zvizere. Broadcom, Marvell, Intel, nevamwe vashoma chete ndivo vane mhinduro dzakazara pamusika.
Marvell yakaunza shanduko yetekinoroji ye2.5D CPO ichishandisa nzira yeVIA-LAST gore rapfuura. Mushure mekunge chip yesilicon optical yagadziriswa, TSV inogadziriswa nekugona kwayo kugadzirisa kweOSAT, uye ipapo chip yemagetsi flip-chip inowedzerwa kune chip yesilicon optical. Mamodule gumi nematanhatu e optical ne chip yekuchinja Marvell Teralynx7 zvakabatana paPCB kuti zvigadzire switch, iyo inogona kusvika padanho re switching re12.8Tbps.
PaOFC yegore rino, Broadcom naMarvell vakaratidzawo chizvarwa chitsva chemachipisi e51.2Tbps vachishandisa tekinoroji ye optoelectronic co-packaging.
Kubva paruzivo rwechizvino-zvino rweCPO kubva kuBroadcom, CPO 3D package kuburikidza nekuvandudzwa kwemaitiro ekuwana huwandu hweI/O hwakakwira, kushandiswa kwesimba reCPO kusvika ku5.5W/800G, chiyero chekushanda nesimba chiri chakanaka kwazvo. Panguva imwe chete, Broadcom iri kubudawo kusvika kune rimwe wave re200Gbps uye 102.4T CPO.
Cisco yakawedzerawo mari yayo muCPO tekinoroji, uye yakaratidza chigadzirwa cheCPO muOFC yegore rino, ichiratidza kuunganidzwa kwayo kweCPO tekinoroji uye mashandisirwo ayo pamultiplexer/demultiplexer yakabatana zvakanyanya. Cisco yakati ichaita kuyedza kuiswa kweCPO mu51.2Tb switches, ichiteverwa nekushandiswa kukuru mu102.4Tb switch cycles.
Intel yagara ichigadzira maCPO based switches, uye mumakore achangopfuura Intel yakaramba ichishanda neAyar Labs kuti iongorore mhinduro dze higher bandwidth signal interconnection solutions dzakagadzirwa pamwe chete, zvichigadzira nzira yekugadzira akawanda ma optoelectronic co-packaging uye optical interconnect devices.
Kunyangwe ma modules anodzvanywa achiri sarudzo yekutanga, kuvandudzwa kwesimba remagetsi kunogona kuunzwa neCPO kwakwezva vagadziri vakawanda. Sekureva kweLightCounting, kutumirwa kweCPO kuchatanga kuwedzera zvakanyanya kubva pamaports e800G ne1.6T, zvishoma nezvishoma kuchatanga kuwanikwa mumusika kubva muna 2024 kusvika 2025, uye kuchaumba huwandu hukuru kubva muna 2026 kusvika 2027. Panguva imwe chete, CIR inotarisira kuti mari inowanikwa pamusika kubva pakurongedza kwe photoelectric ichasvika mabhiriyoni emadhora 5.4 muna 2027.
Pakutanga kwegore rino, TSMC yakazivisa kuti ichabatana neBroadcom, Nvidia nevamwe vatengi vakuru kuti vagadzire pamwe chete tekinoroji yesilicon photonics, common packaging optical components CPO nezvimwe zvigadzirwa zvitsva, process technology kubva pa45nm kusvika pa7nm, uye yakati hafu yechipiri inokurumidza yegore rinouya yakatanga kusangana nehurongwa hukuru, kana kuti kusvika padanho rehuwandu muna 2025.
Semunda we tekinoroji inosanganisira michina ye photonic, ma circuits akabatanidzwa, kurongedza, modeling uye simulation, tekinoroji ye CPO inoratidza shanduko dzinounzwa ne optoelectronic fusion, uye shanduko dzinounzwa pakutumira data pasina mubvunzo dzinokanganisa. Kunyangwe kushandiswa kwe CPO kuchingoonekwa chete munzvimbo huru dzedata kwenguva yakareba, nekuwedzera kwesimba guru remakomputa uye zvinodiwa zve bandwidth yakakwira, tekinoroji ye CPO photoelectric co-seal yave nzvimbo itsva yehondo.
Zvinogona kuonekwa kuti vagadziri vanoshanda muCPO vanowanzo tenda kuti 2025 ichave key node, iyo iriwo node ine exchange rate ye102.4Tbps, uye kuipa kwema pluggable modules kuchawedzerwa zvakanyanya. Kunyangwe maCPO applications angauya zvishoma nezvishoma, opto-electronic co-packaging pasina mubvunzo ndiyo chete nzira yekuwana high speed, high bandwidth uye low power networks.
Nguva yekutumira: Kubvumbi-02-2024