Evolution uye kufambira mberi kweCPOoptoelectronicco-packaging teknolojia
Optoelectronic co-packaging haisi tekinoroji nyowani, kusimudzira kwayo kunogona kuteverwa kumashure kuma1960s, asi panguva ino, photoelectric co-packaging ingori nyore pasuru ye.optoelectronic zvishandisopamwe chete. Pakazosvika ma1990, nekukwira kweOptical communication moduleindasitiri, photoelectric copackaging yakatanga kubuda. Nekuvhuvhuta kwesimba repamusoro remakomputa uye yakakwira bandwidth kudiwa gore rino, photoelectric co-packaging, uye yakabatana yayo yebazi tekinoroji, yakagamuchira zvakare kutariswa kwakawanda.
Mukuvandudza tekinoroji, nhanho yega yega ine mafomu akasiyana, kubva ku2.5D CPO inoenderana ne20/50Tb/s kudiwa, kusvika ku2.5D Chiplet CPO inoenderana ne50/100Tb/s kudiwa, uye pakupedzisira kuona 3D CPO inoenderana ne100Tb/s. rate.
Iyo 2.5D CPO mapakeji iyoOptical moduleuye network chinja chip pane imwechete substrate kupfupisa mutsara kure uye kuwedzera I / O density, uye 3D CPO inobatanidza zvakananga IC yemaziso kune iyo intermediary layer kuti iwane kubatanidzwa kweI / O pitch isingasviki 50um. Chinangwa chekushanduka-shanduka kwacho chakanyatsojeka, ndiko kuderedza kureba pakati pe photoelectric conversion module uye network switching chip zvakanyanya sezvinobvira.
Parizvino, CPO ichiri muhucheche, uye kuchine matambudziko akadai segoho rakaderera uye mari yekuchengetedza yakakura, uye vashoma vanogadzira pamusika vanogona kupa zvizere CPO zvine chekuita nezvigadzirwa. Chete Broadcom, Marvell, Intel, uye vashoma vevamwe vatambi vane zvigadziriso zvizere pamusika.
Marvell yakaunza 2.5D CPO tekinoroji switch uchishandisa iyo VIA-LAST maitiro gore rapfuura. Mushure mekunge silicon optical chip yagadziriswa, TSV inogadziriswa nekugadzirisa kugona kweOSAT, uyezve magetsi chip flip-chip inowedzerwa kune silicon optical chip. 16 optical modules uye switching chip Marvell Teralynx7 yakabatana paPCB kuti igadzire switch, inogona kuwana chiyero chekuchinja che12.8Tbps.
PaOFC yegore rino, Broadcom naMarvell vakaratidzawo chizvarwa chazvino che51.2Tbps switch machipisi vachishandisa optoelectronic co-packaging tekinoroji.
Kubva kuBroadcom ichangoburwa chizvarwa cheCPO tekinoroji ruzivo, CPO 3D package kuburikidza nekuvandudzwa kwemaitiro ekuwana yakakwira I / O density, CPO mashandisiro emagetsi kusvika 5.5W/800G, simba rekuita reshiyo yakanaka kwazvo kuita kwakanaka kwazvo. Panguva imwecheteyo, Broadcom iri kupazawo kusvika kune imwechete wave ye200Gbps uye 102.4T CPO.
Cisco yakawedzerawo mari yayo muCPO tekinoroji, uye yakaita CPO chigadzirwa kuratidzira muOFC yegore rino, ichiratidza kuunganidzwa kwayo tekinoroji yeCPO uye kushandisa pane yakawedzera kubatanidzwa multiplexer/demultiplexer. Cisco yakati ichaita mutyairi kutumirwa kweCPO mu51.2Tb switch, ichiteverwa nekutorwa kwakakura mu102.4Tb switch cycles.
Intel yagara ichiunza CPO yakavakirwa switch, uye mumakore achangopfuura Intel yakaramba ichishanda neAyar Labs kuti iongorore yakavharwa yakakwira bandwidth chiratidzo chekubatanidza mhinduro, ichigadzira nzira yekugadzirwa kwakawanda kweoptoelectronic co-packaging uye optical interconnect zvishandiso.
Kunyangwe pluggable modules ichiri sarudzo yekutanga, iyo yakazara simba yekuvandudza simba iyo CPO inogona kuunza yakakwezva vagadziri vakawanda. Maererano neLightCounting, CPO inotakura ichatanga kuwedzera zvakanyanya kubva ku800G uye 1.6T ports, zvishoma nezvishoma inotanga kuwanikwa mune zvekutengeserana kubva ku2024 kusvika ku2025, uye inogadzira vhoriyamu yakakura kubva ku2026 kusvika ku2027. Panguva imwecheteyo, CIR inotarisira kuti mari yemusika yephotoelectric yakazara packaging ichasvika madhora 5.4 bhiriyoni muna 2027.
Pakutanga gore rino, TSMC yakazivisa kuti ichabatana maoko neBroadcom, Nvidia nevamwe vatengi vakakura kuti vabatane kugadzira silicon photonics tekinoroji, yakajairika kurongedza optical components CPO uye zvimwe zvigadzirwa zvitsva, process tekinoroji kubva ku45nm kusvika 7nm, uye yakataura kuti inokurumidza hafu yechipiri. yegore rinotevera yakatanga kusangana neodha huru, 2025 kana zvakadaro kusvika padanho revhoriyamu.
Senzvimbo yehunyanzvi hwekuita tekinoroji inosanganisira mafotonic zvishandiso, maseketi akabatanidzwa, kurongedza, kuenzanisira uye simulation, tekinoroji yeCPO inoratidza shanduko dzakaunzwa neoptoelectronic fusion, uye shanduko dzakaunzwa pakufambiswa kwedata pasina mubvunzo dzinopaza. Kunyange zvazvo kushandiswa kweCPO kungangoonekwa munzvimbo huru dze data kwenguva yakareba, pamwe nekuwedzera kwekuwedzera kwesimba guru rekombiyuta uye kukwirira kwebhanwidth zvinodiwa, CPO photoelectric co-seal teknolojia yava nzvimbo itsva yehondo.
Zvinogona kuonekwa kuti vagadziri vanoshanda muCPO vanowanzo tenda kuti 2025 ichava node yakakosha, inovawo node ine chiyero chekuchinjana che 102.4Tbps, uye kuipa kwemamodules e pluggable kuchawedzerwa. Kunyangwe zvikumbiro zveCPO zvingauya zvishoma nezvishoma, opto-electronic co-packaging pasina mubvunzo ndiyo nzira chete yekuwana kukurumidza, yakakwirira bandwidth uye yakaderera magetsi network.
Nguva yekutumira: Kubvumbi-02-2024