Inosuma iyo system kurongedza ye optoelectronic zvishandiso

Inosuma iyo system kurongedza ye optoelectronic zvishandiso

Optoelectronic mudziyo system kurongedzaOptoelectronic mudziyosystem packaging inzira yekubatanidza sisitimu yekurongedza optoelectronic zvishandiso, zvemagetsi zvikamu uye zvinoshanda zvekushandisa. Optoelectronic mudziyo packaging inoshandiswa zvakanyanya mukatioptical communicationsystem, data center, industry laser, civil optical display uye mamwe minda. Inogona kukamurwa zvakanyanya kuita anotevera mazinga ekurongedza: chip IC level kurongedza, mudziyo kurongedza, module kurongedza, system board level kurongedza, subsystem kusangana uye system yekubatanidza.

Optoelectronic madivayiri akasiyana kubva kune general semiconductor madivayiri, mukuwedzera kune ine zvikamu zvemagetsi, kune optical collimation michina, saka iyo pasuru chimiro chemudziyo chakanyanya kuoma, uye kazhinji chinoumbwa nezvimwe zvakasiyana-siyana zvikamu. Iwo madiki-zvikamu anowanzo ane zvimiro zviviri, chimwe ndechekuti laser diode,photodetectoruye zvimwe zvikamu zvakaiswa muhomwe yakavharwa. Zvinoenderana nekushandisa kwayo inogona kukamurwa kuita yekutengeserana standard package uye zvinodiwa nevatengi zveiyo proprietary package. Iyo yekutengesa standard package inogona kukamurwa kuita coaxial TO package uye butterfly package.

1.TO pasuru Coaxial package inoreva maoptical components (laser chip, backlight detector) muchubhu, lenzi uye nzira yekuona yekunze yakabatana fiber iri pane imwechete core axis. Iyo laser chip uye backlight detector mukati meiyo coaxial package mudziyo yakaiswa pane thermic nitride uye yakabatana nekunze redunhu kuburikidza negoridhe waya inotungamira. Nekuti pane lenzi imwe chete mucoaxial package, kugona kwekubatanidza kunovandudzwa kana zvichienzaniswa neye butterfly package. Zvinhu zvinoshandiswa kune TO chubhu shell inonyanya simbi isina tsvina kana Corvar alloy. Iyo yese dhizaini inoumbwa ne base, lens, yekunze inotonhorera block uye zvimwe zvikamu, uye chimiro chiri coaxial. Kazhinji, KUTI pave nelaser mukati me laser chip (LD), backlight detector chip (PD), L-bracket, etc. Kana paine mukati mekushisa kwekushisa system seTEC, iyo yemukati thermistor uye control chip inodiwa zvakare.

2. Butterfly package Nekuti chimiro chakafanana neshavishavi, iyi pasuru fomu inodaidzwa kunzi butterfly package, sezviri kuratidzwa muMufananidzo 1, chimiro cheshavishavi rinovharisa optical device. Semuyenzaniso,butterfly SOA(butterfly semiconductor optical amplifier）.Butterfly package tekinoroji inoshandiswa zvakanyanya mukumhanya kukuru uye kureba kutumira optical fiber communication system. Iine humwe hunhu, hwakadai senge nzvimbo yakakura mune butterfly package, iri nyore kukwira semiconductor thermoelectric inotonhorera, uye kuona inoenderana tembiricha yekudzora basa; Iyo yakabatana laser chip, lens uye zvimwe zvikamu zviri nyore kurongeka mumuviri; Makumbo epombi akagoverwa kumativi ose, nyore kuona kuwirirana kwedunhu; Chimiro chakanakira kuyedza uye kurongedza. Iyo goko rinowanzoita cuboid, chimiro uye kuita basa rinowanzo kuomesesa, rinogona kuvakwa-mufiriji, kupisa sink, ceramic base block, chip, thermistor, backlight monitoring, uye inogona kutsigira kusungirirwa kunotungamira kwezvose zviri pamusoro apa. Nzvimbo yakakura yegoko, yakanaka kupisa kupisa.