Inosuma hurongwa hwekurongedza zvishandiso zve optoelectronic

Inosuma hurongwa hwekurongedza zvishandiso zve optoelectronic

Kurongedza sisitimu yemidziyo yemagetsiMudziyo weOptoelectronicKurongedza sisitimu inzira yekubatanidza sisitimu kurongedza zvishandiso zve optoelectronic, zvikamu zvemagetsi uye zvinhu zvinoshanda. Kurongedza zvishandiso zve optoelectronic kunoshandiswa zvakanyanya mukutaurirana kwemazisosystem, data center, industrial laser, civil optical display nedzimwe nzvimbo. Inogona kukamurwa zvakanyanya muzvikamu zvinotevera zvekurongedza: chip IC level packaging, device packaging, module packaging, system board level, subsystem assembly uye system integration.

Midziyo yeOptoelectronic yakasiyana nemidziyo yesemiconductor, pamusoro pekuva nezvikamu zvemagetsi, kune michina ye optical collimation, saka chimiro chepakeji yemudziyo chakaoma, uye chinowanzo umbwa nezvimwe zvikamu zvakasiyana. Zvikamu izvi zvinowanzova nezvikamu zviviri, chimwe ndechekuti laser diode,mudziyo wekuona fotouye zvimwe zvikamu zvinoiswa mupakeji yakavharwa. Zvichienderana nekushandiswa kwayo zvinogona kukamurwa kuita pakeji yepamutemo yekutengeserana uye zvinodiwa nevatengi vepakeji yacho. Pakeji yepamutemo yekutengeserana inogona kukamurwa kuita pakeji yecoaxial TO uye pakeji yebhatafurayi.

1.TO package Coaxial package inoreva zvinhu zvinoonekwa (laser chip, backlight detector) muchubhu, lenzi nenzira ye optical ye external connected fiber zviri pa core axis imwechete. Laser chip uye backlight detector mukati me coaxial package device zvakaiswa pa thermic nitride uye zvakabatana ne external circuit kuburikidza ne gold wire lead. Nekuti pane lenzi imwe chete mu coaxial package, coupling efficiency inovandudzwa kana tichienzanisa ne butterfly package. Zvinhu zvinoshandiswa pa TO tube shell zvinonyanya kushandiswa ne stainless steel kana Corvar alloy. Chimiro chose chinoumbwa ne base, lenzi, external cooling block nezvimwe zvikamu, uye chimiro chacho chiri coaxial. Kazhinji, TO package laser mukati me laser chip (LD), backlight detector chip (PD), L-bracket, nezvimwewo. Kana paine internal temperature control system yakaita se TEC, internal thermistor uye control chip zvinodiwawo.

2. Pakeji yeshavishavi Nekuti chimiro chakaita seshavishavi, chimiro ichi chepakeji chinonzi pakeji yeshavishavi, sezvakaratidzwa muMufananidzo 1, chimiro chemudziyo wekuona weshavishavi. Semuenzaniso,shavishavi SOA()amplifier ye optical yeshavishavi semiconductor）. Tekinoroji yemapakeji eButterfly inoshandiswa zvakanyanya muhurongwa hwekutaurirana hwemagetsi ekufambisa nekukurumidza uye kure kure. Ine zvimwe zvinhu, zvakaita senzvimbo yakakura mupakeji yebutterfly, iri nyore kuisa semiconductor thermoelectric cooler, uye inoita basa rekudzora tembiricha rinoenderana; Chip yelaser, lenzi nezvimwe zvikamu zviri nyore kurongeka mumuviri; Makumbo epombi akapararira kumativi ese, zviri nyore kuona kubatana kwedunhu; Chimiro chacho chiri nyore kuyedza nekurongedza. Goko racho rinowanzo kuve cuboid, chimiro nebasa rekushandisa zvinowanzo kuve zvakaoma, zvinogona kuva zvakavakirwa mukati mefiriji, heat sink, ceramic base block, chip, thermistor, backlight monitoring, uye zvinogona kutsigira ma bonding leads ezvikamu zvese zvataurwa pamusoro apa. Nzvimbo yakakura yegoko, kupisa kwakanaka.