Optoelectronicnzira yekubatanidza
Kubatanidzwa kwephotonicsuye zvemagetsi inhanho yakakosha mukuvandudza kugona kwemasisitimu ekugadzirisa ruzivo, kugonesa kukurumidza kufambiswa kwedata, kuderera kwesimba rekushandisa uye mamwe compact mudziyo dhizaini, uye kuvhura mikana mitsva mikuru yekugadzira sisitimu. Nzira dzekubatanidza dzinowanzo kukamurwa kuita mapoka maviri: monolithic kubatanidzwa uye akawanda-chip kubatanidzwa.
Monolithic kubatanidzwa
Kubatanidzwa kwemonolithic kunosanganisira kugadzira photonic uye zvemagetsi zvikamu pane imwechete substrate, kazhinji kushandisa zvinhu zvinoenderana uye maitiro. Iyi nzira inotarisa pakugadzira chimiro chisina musono pakati pechiedza nemagetsi mukati meimwe chip.
Zvakanakira:
1. Deredza kurasikirwa kwekubatanidza: Kuisa mafotoni uye zvikamu zvemagetsi padhuze kunoderedza kurasikirwa kwechiratidzo kunobatanidza ne-off-chip connections.
2, Kuvandudzwa kwekuita: Kubatanidzwa kwakasimba kunogona kutungamirira kukurumidza kufambisa data nekuda kwenzira dzakapfupika dzechiratidzo uye kuderedzwa latency.
3, Saizi diki: Kubatanidzwa kwemonolithic kunobvumira midziyo yakanyatso compact, iyo inonyanya kubatsira kune nzvimbo-yakaganhurwa maapplication, senge data data kana midziyo inobatwa nemaoko.
4, kuderedza kushandiswa kwesimba: kubvisa kudiwa kwemapakeji akaparadzana uye kureba kwekubatanidza, izvo zvinogona kuderedza zvakanyanya zvinodiwa zvemagetsi.
Dambudziko:
1) Kuenderana kwezvinhu: Kutsvaga zvinhu zvinotsigira ese emhando yepamusoro maerekitironi uye mafotonic mabasa zvinogona kunetsa nekuti zvinowanzoda zvakasiyana zvivakwa.
2, kuenderana kwemaitiro: Kubatanidza maitiro akasiyana ekugadzira emagetsi nemafotoni pane imwechete substrate pasina kusvibisa mashandiro echero chikamu chimwe ibasa rakaoma.
4, Kugadzira kwakaoma: Iyo yakanyanya kurongeka inodiwa kune zvemagetsi uye photononic zvimiro zvinowedzera kuoma uye mutengo wekugadzira.
Multi-chip kubatanidzwa
Iyi nzira inobvumira kushanduka kukuru mukusarudza zvinhu uye maitiro ebasa rega rega. Mukubatanidzwa uku, zvikamu zvemagetsi uye zvepikicha zvinobva kune zvakasiyana-siyana uye zvino zvinounganidzwa pamwe chete uye kuiswa pane imwe pasuru kana substrate (Mufananidzo 1). Zvino ngatinyorei nzira dzekubatanidza pakati peoptoelectronic chips. Direct bonding: Iyi nzira inosanganisira kubata kwakananga kwemuviri uye kubatana kwenzvimbo mbiri dzakarongwa, kazhinji dzinofambiswa nemasimba ekubatanidza mamorekuru, kupisa, uye kudzvanywa. Iyo ine mukana wekureruka uye inogona kuderera zvakanyanya kurasikirwa kwekubatanidza, asi inoda zvakanyatsoenderana uye yakachena nzvimbo. Fiber / grating coupling: Muchirongwa ichi, fiber kana fiber array inopindirana uye inosungirirwa kumucheto kana pamusoro pe photonic chip, zvichiita kuti chiedza chibatanidzwe mukati uye kunze kwechip. Iyo grating inogona zvakare kushandiswa pakatarisana nekubatanidza, kuvandudza kugona kwekufambisa kwechiedza pakati pefotonic chip uye yekunze fiber. Kuburikidza ne-silicon maburi (TSVs) uye ma-micro-bumps: Kuburikidza ne-silicon maburi akatarisana akabatana kuburikidza nesilicon substrate, achibvumira machipisi kuti aturikirwe mumativi matatu. Yakasanganiswa neiyo micro-convex mapoinzi, ivo vanobatsira kuwana magetsi ekubatanidza pakati pemagetsi uye photonic machipisi muakaturikidzana masisitimu, akakodzera kubatanidzwa kwepamusoro-density. Optical intermediary layer: Iyo optical intermediary layer ndeye yakaparadzana substrate ine optical waveguides inoshanda semurevereri wekufambisa masaini masaini pakati pemachipisi. Inobvumira kurongeka kwakanyatso, uye kuwedzera kungoitaoptical componentsinogona kubatanidzwa kuti iwedzere kushanduka kwekubatanidza. Hybrid bonding: Iyi tekinoroji yepamusoro yekubatanidza inosanganisa yakananga bonding uye micro-bump tekinoroji kuti iwane yakakwirira-density magetsi ekubatanidza pakati machipisi uye emhando yepamusoro optical interfaces. Icho chiri kunyanya kuvimbisa kwepamusoro-kuita optoelectronic co-kubatanidzwa. Solder bump bonding: Zvakafanana neflip chip bonding, solder bumps inoshandiswa kugadzira magetsi. Zvisinei, mumamiriro ezvinhu ekubatanidza optoelectronic, kunyanya kukoshesa kunofanira kubhadharwa kudzivirira kukuvadzwa kwezvikamu zve photonic zvinokonzerwa nekupisa kwekupisa uye kuchengetedza kutarisa kwemaziso.
Mufananidzo 1: : Electron/photon chip-to-chip Bonding scheme
Mabhenefiti emaitiro aya akakosha: Sezvo nyika yeCMOS ichiramba ichitevera kuvandudzwa kweMutemo waMoore, zvinokwanisika kukurumidza kugadzirisa chizvarwa chega chega cheCMOS kana Bi-CMOS pane yakachipa silicon photonic chip, uchikohwa mabhenefiti ezvakanakisa maitiro mukati. photonics uye zvemagetsi. Nekuti mafotonics kazhinji haadi kugadzirwa kwezvimiro zvidiki (makiyi saizi anosvika zana nanometers akajairwa) uye zvishandiso zvakakura zvichienzaniswa nematransistors, kufunga nezvehupfumi kunowanzo kusundira mafotonic zvishandiso kuti zvigadzirwe mune imwe nzira, yakaparadzaniswa kubva kune chero yepamusoro. zvemagetsi zvinodiwa kune yekupedzisira chigadzirwa.
Zvakanakira:
1, kuchinjika: Zvishandiso zvakasiyana uye maitirwo anogona kushandiswa akazvimirira kuti awane kuita kwakanakisa kwemagetsi uye photonic zvikamu.
2, maitiro ekukura: kushandiswa kwemaitiro akakura ekugadzira echikamu chimwe nechimwe anogona kurerutsa kugadzirwa uye kuderedza mutengo.
3, Kuvandudza uye kugadzirisa zviri nyore: Kuparadzaniswa kwezvikamu kunobvumira zvikamu zvega kuti zvitsiviwa kana kuvandudzwa nyore nyore pasina kukanganisa hurongwa hwose.
Dambudziko:
1, kurasikirwa kwekubatanidza: Iyo ye-off-chip yekubatanidza inounza kumwe kurasikirwa kwechiratidzo uye ingangoda maitiro akaomarara ekugadzirisa.
2, yakawedzera kuomarara uye saizi: Zvikamu zvega zvinoda kuwedzera kurongedza uye kubatana, zvichikonzera hukuru hukuru uye zvinogona kukwira mutengo.
3, mashandisiro emagetsi epamusoro: Nzira refu dzechiratidzo uye kuwedzera kurongedza kunogona kuwedzera simba rinodiwa kana richienzaniswa nekubatanidza monolithic.
Mhedziso:
Kusarudza pakati pemonolithic uye yakawanda-chip yekubatanidza zvinoenderana nezvinodiwa-zvakananga zvekushandisa, zvinosanganisira zvibodzwa zvekushanda, zvipingamupinyi zvehukuru, kutariswa kwemitengo, uye kukura kwetekinoroji. Pasinei nekugadzira kuoma, kubatanidzwa kwemonolithic kunobatsira kune zvikumbiro zvinoda kunyanyisa miniaturization, kuderera kwesimba rekushandisa, uye yakakwirira-kumhanya kufambisa data. Pane kudaro, kubatanidzwa kwe-multi-chip kunopa dhizaini yakakura kuchinjika uye inoshandisa hunyanzvi hwekugadzira huripo, huchiita kuti ive yakakodzera kune zvikumbiro apo zvinhu izvi zvinopfuura mabhenefiti ekubatana kwakasimba. Sezvo tsvagiridzo ichifambira mberi, nzira dzakasanganiswa dzinosanganisa zvinhu zvemazano ese ari kuongororwa kuti agone kuita sisitimu uku achidzikisa matambudziko ane chekuita neimwe nzira.
Nguva yekutumira: Jul-08-2024